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Article
Publication date: 15 February 2024

Kai Deng, Liang Zhang, Chen Chen, Xiao Lu, Lei Sun and Xing-Yu Guo

This study aims to explore the feasibility of adding Si3N4 nanoparticles to Sn58Bi and provides a theoretical basis for designing and applying new lead-free solder materials for…

Abstract

Purpose

This study aims to explore the feasibility of adding Si3N4 nanoparticles to Sn58Bi and provides a theoretical basis for designing and applying new lead-free solder materials for the electronic packaging industry.

Design/methodology/approach

In this paper, Sn58Bi-xSi3N4 (x = 0, 0.2, 0.4, 0.6, 0.8, 1.0 Wt.%) was prepared for bonding Cu substrate, and the changes in thermal properties, wettability, microstructure, interfacial intermetallic compound and mechanical properties of the composite solder were systematically studied.

Findings

The experiment results demonstrate that including Si3N4 nanoparticles does not significantly impact the melting point of Sn58Bi solder, and the undercooling degree of solder only fluctuates slightly. The molten solder spreading area reached a maximum of 96.17 mm2, raised by 19.41% relative to those without Si3N4, and the wetting angle was the smallest at 0.6 Wt.% of Si3N4, with a minimum value of 8.35°. When the Si3N4 nanoparticles reach 0.6 Wt.%, the solder joint microstructure is significantly refined. Appropriately adding Si3N4 nanoparticles will slightly increase the solder alloy hardness. When the concentration of Si3N4 reaches 0.6 Wt.%, the joints shear strength reached 45.30 MPa, representing a 49.85% increase compared to those without additives. A thorough examination indicates that legitimately incorporating Si3N4 nanoparticles into Sn58Bi solder can enhance its synthetical performance, and 0.6 Wt.% is the best addition amount in our test setting.

Originality/value

In this paper, Si3N4 nanoparticles were incorporated into Sn58Bi solder, and the effects of different contents of Si3N4 nanoparticles on Sn58Bi solder were investigated from various aspects.

Details

Soldering & Surface Mount Technology, vol. ahead-of-print no. ahead-of-print
Type: Research Article
ISSN: 0954-0911

Keywords

Article
Publication date: 9 November 2012

Wei Ping He

The purpose of this paper is to provide an overview of China's contemporary banking regulatory system, with particular focus on regulatory control of foreign banks trading in…

2882

Abstract

Purpose

The purpose of this paper is to provide an overview of China's contemporary banking regulatory system, with particular focus on regulatory control of foreign banks trading in China. The paper addresses three aspects of Chinese banking regulation: what does China regulate; why does China regulate; and how does China regulate. Much of the discussion is concerned with China's regulatory agencies particularly with the role of the CBRC as the principal regulator in China's banking sector.

Design/methodology/approach

In the first instance the paper presents an overview of banking regulatory models gained from a review of theoretical literature in the area. Then through a wide ranging review of Chinese publications, both academic and official, the paper seeks to relate the course of regulatory reform in China, both in terms of compliance with orthodox regulatory theory, and the unique regulatory requirements of the Chinese banking system.

Findings

The paper recognises that China has embraced the need for banking regulation with the establishment of an institutional structure that is responsive to both banking supervision and government policy. Within that structure the role of the CBRC, the pervasive manner in which that agency operates, and the content of its regulatory output have been identified and critically reviewed.

Originality/value

In its review of the modernization of China's banking regulatory system, the paper achieves originality from the author's research into, and critical reflections on Chinese generated literature, both institutional and academic, which is then communicated in a manner that will be understood by readers familiar with Western banking regulatory theory.

Details

Journal of Financial Regulation and Compliance, vol. 20 no. 4
Type: Research Article
ISSN: 1358-1988

Keywords

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