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This study aims to focus on the surface mount technology (SMT) mass production process of Sn-9Zn-2.5Bi-1.5In solder. It explores it with some components that will provide theoretical support for the industrial SMT application of Sn-Zn solder.

This study evaluates the properties of solder pastes and selects a more appropriate reflow parameter by comparing the microstructure of solder joints with different reflow soldering profile parameters. The aim is to provide an economical and reliable process for SMT production in the industry.

Solder paste wettability and solder ball testing in a nitrogen environment with an oxygen content of 3,000 ppm meet the requirements of industrial production. The printing performance of the solder paste is good and can achieve a printing rate of 100–160 mm/s. When soldering with a traditional stepped reflow soldering profile, air bubbles are generated on the surface of the solder joint, and there are many voids and defects in the solder joint. A linear reflow soldering profile reduces the residence time below the melting point of the solder paste (approximately 110 s). This reduces the time the zinc is oxidized, reducing solder joint defects. The joint strength of tin-zinc joints soldered with the optimized reflow parameters is close to that of Sn-58Bi and SAC305, with high joint strength.

This study attempts to industrialize the application of Sn-Zn solder and solves the problem that Sn-Zn solder paste is prone to be oxidized in the application and obtains the SMT process parameters suitable for Sn-9Zn-2.5Bi-1.5In solder.

In the electronic assembly industry, low-temperature soldering holds great potential to be used in surface mounting technology. Tin–bismuth (Sn–Bi) eutectic alloys are lead-free solders applied in consumer electronics because of their low melting point, high strength and low cost. This paper aims to investigate how to address the problem of hot tear crack formation during Sn–Bi low-temperature solder (LTS) in the mass production of consumer electronics.

This paper explored the development of hot tear cracks during Sn–Bi soldering in the fabrication of flip chip ball grid arrays. Experiments were designed to simulate various conditions encountered in Sn–Bi soldering. Quantitative analysis was conducted on the number of hot tear cracks observed in different alloy compositions and solder volumes to explore the primary cause of hot tear cracks and possible methods to suppress crack formation.

Hot tear cracks existed in Sn–Bi solders with different bismuth (Bi) contents, but increasing the solder volume reduced the number of hot tear cracks. Experiments were designed to test the degree of chip transient thermal warpage with temperature change, and, according to the results, glue was dispensed in specific areas to reduce chip warpage deformation. Finally, the results of combined process experiments pointed to an effective method of low-temperature soldering to suppress hot tear cracks.

The study focuses on Sn–Bi solders only without other solder pastes such as SAC305 or Sn–Zn series.

With the growing popularity of smart electronics, especially in intelligent terminals, new energy vehicles electronics, solar photovoltaic and other field, there will be more and more demand for low- temperature, energy-saving, lead-free solders. Therefore, this study will help the industry to roll out LTS (Sn–Bi) solutions rapidly.

In the long term, lean and green manufacturing is expected to be essential for maintaining an advanced manufacturing industry across the world. Developing new LTSs and soldering processes is the most effective, direct solution for energy conservation and emission mitigation. With the growing popularity of smart electronics, especially in intelligent terminals, new energy vehicles and solar photovoltaics, there would be an increased demand for low-temperature, energy-saving, lead-free techniques.

Although there are many methods that can be used to suppress hot tear cracks, there is little research on how to control the hot tear cracks caused by the low-temperature soldering of Sn–Bi in laptop applications. The authors studied the hot tear cracks that developed during the world’s first mass production of 50 million personal laptops based on low-temperature Sn–Bi alloy solder pastes. By controlling the Bi content, redesigning the solder paste printing process (e.g. through a printer’s stencil) and adding dispensing processes, the authors obtained reliable and stable experimental data and conclusions.

The purpose of this paper is to investigate the optimal geometry parameters in a dimple/protrusion-pin finned channel with high thermal performance.

The BSL turbulence model is used to calculate the flow structure and heat transfer in a dimple/protrusion-pin finned channel. The optimization algorithm is set as Non-dominated Sorting Genetic Algorithm II (NSGA-II). The high Nusselt number and low friction factor are chosen as the optimization objectives. The pin fin diameter, dimple/protrusion diameter, dimple/protrusion location and dimple/protrusion depth are applied as the optimization variables. An in-house code is used to generate the geometry model and mesh. The commercial software Isight is used to perform the optimization process.

The results show that the Nusselt number and friction factor are sensitive to the geometry parameters. In a pin finned channel with a dimple, the Nusselt number is high at the rear part of the dimple, while it is low at the upstream of the dimple. A high dissipative function is found near the pin fin. In the protrusion channel, the Nusselt number is high at the leading edge of the protrusion. In addition, the protrusion induces a high pressure drop compared to the dimpled channel.

The originality of this paper is to optimize the geometry parameters in a pin finned channel with dimple/protrusion. This is good application for the heat transfer enhancement at the trailing side for the gas turbine.

The purpose of this paper is to investigate the economic significance of informal borrowing between friends and relatives in rural China. Guided by an economic model of household‐production interactions, the paper provides results from a survey of over 1,500 households including general linear model and logistic regression results. The paper finds evidence of a “small farm bias” in the use of informal credit, but the paper cannot generalize this to credit rationing as a matter of course. In part, it is believed that a preference for informal borrowing is related to some forms of credit rationing, spillover effects and collateral as some literature suggests, but the results suggest that by no means are these mutually exclusive or exhaustive.

This paper uses regression techniques based on 1,557 farm household surveys gathered by the authors in Shaanxi, Gansu and Henan Provinces in 2007 and 2008.

The paper argues that informal lending amongst friends and relatives cannot be dismissed as a significant economic factor in the financing of China's agricultural sector. A small farm bias in formal lending is indicated by the results, but there are many factors other than credit rationing which affect a households' decision to borrow informally.

The research is limited to the survey data used. China's agricultural economy is too large to assert that the informal‐formal relationships described herein are general, even though the results are supported by other research.

The paper makes the case that the study of agricultural finance in China should include informal lending as part of any credit study. In addition, the paper argues that the use of the term “informal lending” should not generally group familial lending with other forms of interest‐bearing loans such as pawn shops or money lenders.

China's rural credit needs are huge and many farmers do not have access to formal credit. This paper argues that the strength of trust relationships between friends and family is sufficiently high that nearly 60 percent of all credit outstanding is between friends and relatives at zero interest rates.

This, it is believed, is one of the first comprehensive studies on informal lending in China.

The purpose of this paper is to investigate the relationships between business risks and credit choices of 400 farm households surveyed in Shaanxi province in October 2007 in the Yangling district. More specifically, this paper investigates whether or not rural farm households in China balance business risks from agricultural production with financial risk from the use of debt.

The data were collected through a survey of 400 farm households in Shaanxi province conducted in October 2007. Four separate regressions are run using a credit measure as the dependent variable and measures of profitability, risk, risk aversion, and demography, and debt source (formal versus informal lending) as independent variables.

The model shows evidence of risk balancing. That is, there is strong evidence that Chinese farmers reduce credit use and financial risk, as business risks increase.

The results suggest that Chinese policy makers could encourage the use of finacial leverage and prudent debt use by offering risk reducing programs such as crop insurance, weather insurance, or price insurance.

This paper uses a unique survey form to collect production risk data as well as gather information on credit use and sources. Data were collected so that risk measures could easily be computed using a triangular distribution. Furthermore, this is believed to be the first empirical validation of the risk balancing hypothesis.